NTE Electronics NTE425 1.65″ Self−Adhesive Thermal Interface Pad Online

Description

NTE Electronics NTE425 1.65″ Self−Adhesive Thermal Interface Pad
NTE Electronics NTE425 1.65″ Self−Adhesive Thermal Interface Pad
The NTE425 is designed as a pressure sensitive, thermal interface material for use between a high performance processor and a heat sink. NTE425 is a thermally conductive, inherently tacky, +55°C phase change composite supplied on a polyester carrier liner with high visibility protective tabs.

Features

• Thermal Impedance: 0.08°C−in2/W (@ 25psi)
• Inherently Tacky, +55°C Phase Change Composite
• High Visibility Protective Tabs
• Pressure Sensitive Phase Change Thermal Interface Material

Typical Applications:

• Computer and Peripherals
• High Performance Computer Processors
• Graphics Cards
• Power Modules